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PCB와 간지를 분리하여 BOX에서 MAIN장비로 투입하거나 MAIN장비에서 작업이 끝난 PCB를 간지와 함께 BOX

에 수취하는 장비입니다.

Dividing PCB from paper, it inputs it to main equipment from BOX. Or PCB which is completed in MAIN
erquipment, it receives in BOX with the paper.

此设备可将PCB和衬纸分离后，将其从BOX供应至MAIN，再从MAIN将完工的PCB，与衬纸一同收板到BOX
PCBと合紙を分離してBOXからMAIN装備へと投入し、MAIN装備からの作業が終了したPCBを合紙とともにBOXに受け取
るための装備です。

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◼ Application product
   HDI, BGA, FC-BGA, CSP, BOC, FPCB

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◼ Application process
   PLATING, PSR, CIRCUIT

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◼ Application line
   De-smear, FILL cleaning, Chemical-plate, UV,
   LAMINATOR, DEVELOPING, LDI, ETCHING, Exposure

◼ Specification
   Size : 2170L x 1260W x 2000H
   PASS LINE : 940H standard ± 50mm
   (other recieiver also used)
   CYCLE TIME : 10sec
   Product size : 405~415 x 510(510 x 610)
   Product thickness : 0.04 ~ 2.0T(mm)
   Operating method : For TOUCH PANEL use
   Air pressure : 5~6kg/cm3
   Voltage for use : 220V 3Ø 50/60Hz